US-based Solvay Specialty Polymers (Alpharetta, Georgia; www.solvayspecialtypolymers.com) has introduced an ultra-high molecular-weight grade to its “KetaSpire” PEEK range. The new grade offers improved ductility and toughness compared with standard high-molecular weight PEEK products and has been developed to meet the demands of applications requiring enhanced toughness and impact resistance performance, particularly in the semiconductor and oil and gas industries.

The company said "KetaSpire" KT-810 has a higher melt viscosity range than standard high-viscosity PEEK grades and achieves a greater level of mechanical toughness than previously possible with current commercial PEEK materials. It can be processed by conventional methods including extrusion, injection moulding and compression moulding.

The material delivers around a 50% improvement in tensile elongation at break and a 10-20% increase in impact resistance compared to standard high-molecular weight PEEK grades. It is available in two forms: fine powder with an average particle size of approximately 50 micrometers (µm) for compression moulding and in pellets for extrusion and injection moulding.