Solvay Specialty Polymers (Alpharetta, Georgia / USA; www.solvayspecialtypolymers.com) has launched a new high-stiffness “KetaSpire” polyetheretherketone (PEEK) with a stiffness or modulus 50% greater than that of standard neat PEEK grades. “KetaSpire KT-825” nevertheless retains the elongation and toughness of neat PEEK resin, the company said, adding that it is particularly suited for automotive and aerospace applications that offer a high stiffness-to-weight ratio, as well as structural applications in mobile electronics.

Using a proprietary additive and compounding technology that enables high stiffness, ductility and a low specific gravity of 1.35 (compared to 1.30 for neat PEEK), the grade bridges the performance gap between unfilled and glass or carbon fibre-reinforced PEEK, Solvay said. At 1.84 MPa (264 psi), KT-825’s heat deflection temperature (HDT) is 10 °C higher than that of standard unfilled PEEK, while its modulus is 50% greater than that of natural resin at temperatures below the glass transition temperature (Tg). The grade is said to exhibit twice the tensile and flexural modili of unfilled PEEK at temperatures above the Tg, making it particularly suitable for applications that require operating temperatures of 150 °C.

Solvay added that KT-825’s flexural strength is about 10% higher than that of standard unfilled PEEK, with a melt viscosity similar to that of a 30% glass fibre-reinforced PEEK compound. In addition to meeting UL’s V-0 flammability requirements at a thickness of 0.8 mm, the grade is also said to achieve a 70% higher dielectric strength compared to neat PEEK.

In its natural state, KT-825 has a uniform light beige appearance and can be processed by conventional means. Solvay said it can supply black and other colours upon request, adding that the product is available for sampling and pilot-scale production.