Sabic (Riyadh / Saudi Arabia; www.sabic.com) launched a range of next-generation “Thermocomp” HMD-D compounds for markets in Europe and the Americas at “NPE” (www.npe.org), the US plastics trade fair that was held earlier this month in Florida – see Plasteurope.com of 22.05.2018. The compounds, which were initially launched in Asia, are a high-performance, glass-reinforced PC material.

The series of six grades are said to possess a unique combination of high modulus and ductility to enable the manufacture of lighter, thinner and stronger parts. Sabic said they have been engineered for challenging structural components in the consumer electronics, healthcare and transportation sectors.

“From smartphone cases to medical device housings and mass transit interior panels, there is an urgent need on the part of OEMs to replace metal and other traditional materials to reduce weight, expand design freedom and cut processing costs and complexity,” said Joshua Chiaw, director of compounds, adding that Sabic has seen “enthusiastic and widespread adoption” by its customers in Asia.

A “distinctive” combination of better ductility and dimensional stability/warpage control than other high-modulus PC-based materials is said to allow, for example, the creation of thin-wall devices that may withstand stringent drop testing without cracking. The compounds also use special glass fibres that minimise warpage. Sabic said grades with different glass fibre loadings of 10-50% are available to meet various modulus requirements.

Other characteristics offered by the HMD-D products are an excellent appearance as the floating of glass fibres to the surface is minimised, as well as improved melt flow with parts unaffected by heat and moisture ageing, unlike those made with various competitive materials. Their excellent thermal stability also allows them to be processed at a relatively high temperature, Sabic said. All grades contain halogen-free flame retardants.