Japanese engineering plastics producer Polyplastics (Tokyo; www.polyplastics.com) has launched a series of low-dielectric liquid crystal polymers (LCPs) for next-generation communication devices. Its “Laperos” E420P is the first in a series of low-dielectric grades, which have been developed to meet increasing demand from 5G and vehicle-to-everything (V2X) telecommunications for autonomous cars and applications using high-speed and high-frequency transmission components.

The grades, said Polyplastics, also possess inherent high heat resistance, mechanical properties, chemical resistance, high flow and low warpage for films and connectors in cabling, antennas and circuit boards. They also fulfil downsizing requirements and can be used for increasingly complex designs in connector applications as well as in surface mount technology (SMT) processes.

Polyplastics said it will expand its series of low-dielectric LCPs to meet broader performance requirements, with plans to include grades with enhanced low warpage, higher heat resistance and greater flow for compact, fine-pitched connectors. The company noted that in tests using its own connector moulds, the new grades were moulded at lower packaging pressure than conventional grades.