With its “PPO S 120 Resin”, GE Plastics Europe (NL-4600 AC Bergen op Zoom) is introducing a new PPE-based additive for SBC and epoxy blends. The low-molecular polymer is claimed to improve the thermal stability and high-temperature property profile of adhesives and sealing compounds, as well as the permittivity and fracture toughness of printed circuit boards. According to GEP, the new material is eminently miscible with polystyrene groups and can be processed on standard plant either in a solution or melt mixture or by injection moulding and extrusion. SBC adhesives produced in this way are competitive with high-priced PCP and PU adhesives. By comparison with the high-molecular PPE traditionally used, a considerable reduction is achieved in solvent consumption and temperature level for epoxy blends.

• Plasteurope.com Service: Product information and data sheets “PPO S120”: PIE-No. 44424.