The market for injection moulded parts for mobile phones is relatively uncomplicated, even though the structure of the customer industry is global. Until now, the markets have been shared essentially by three German, two American, two Finnish and one Swedish company. The recent takeover of Heinze (D-32045 Herford) by Balda AG (D-32549 Bad Oeynhausen), was the first step towards a consolidation of the market, and now there is news of a more spectacular development with the recently reported merger plans between the Finnish company Eimo Oy (Norokatu 5, PL 104, FIN-15101 Lahti) and the American Triple S Plastics (14320 Portage Road, Box E, Vicksburg, MI 49097-0905 / USA).

Eimo says its strengths lie in the fields of automation, in-mould decoration and surface finishing, whereas Triple S can contribute above all its high-tech injection moulding and production capacities. The merger, which involved an exchange of shares, is dominated by the worldwide service network and the concentration of R&D. With its combined sales of EUR 178m, the new company is one of the leading suppliers to the mobile phone market.

This is an essential starting position for the company´s future plans because Jalo Paananen, chairman of Eimo and the driving force behind the family company, intends to make the Finnish-American enterprise the world market leader in injection moulding for mobile phones, and also wants to tap additional industrial markets for technical components. Like its competitors, Eimo is also planning above all to expand its Asian commitment. It is also looking to drive further into the American markets where the growth forecasts are well above those of the European market. At present, it looks as if a middle-sized European company is on the way to becoming a major world player.