BEMIS
Development of intelligent packaging platform with Thin Film Electronics / Plans to add printed electronics to packaging by 2014
US flexible packaging supplier Bemis (Minneapolis, Minnesota; www.bemis.com) has teamed up with printed electronics specialist Thin Film Electronics (Thinfilm, Oslo / Norway; www.thinfilm.no) to develop a platform for producing "intelligent" packaging. The platform, which involves the fitting of printed electronics to packaging, is expected to be commercially available in 2014. Thinfilm will provide the printed electronics in the form of sensor labels that can collect and wirelessly communicate information such as physical properties and environmental data in packaged perishable products.

“Intelligent packaging is an emerging technology with many potential intersections with Bemis’ flexible packaging and pressure sensitive materials business segments,” said Henry Theisen, Bemis’ president and CEO. “Our agreement with Thinfilm is an investment in technology that could eventually make printed electronics a component of every package we manufacture.”

Thinfilm said that previous technology partnerships have involved developing an inexpensive, integrated time-temperature sensor for use in monitoring perishable goods and pharmaceuticals. “Under the agreement with Bemis, Thinfilm will extend this work to create a customisable sensor platform that Bemis will subsequently tailor to its customers’ individual requirements,” it explained.

“These are exciting times for the printed electronics market, where innovative solutions that simply could not be manufactured before are soon to be delivered,” said Davor Sutija, Thinfilm’s CEO. “Our partnership with Bemis will lead to new categories and types of packaging that will bring intelligence to everyday lives of millions of people worldwide.” The flexible packaging market for North America alone is estimated at USD 18.3 bn (EUR 14.9 bn), Thinfilm said.

Thinfilm focuses on the creation of printed system products that include memory, sensing, display and wireless communication. In addition to its Oslo headquarters, the company has a product development facility in Linköping / Sweden, sales offices in San Francisco / USA and Tokyo / Japan and manufacturing in Pyongtaek / South Korea.

Thinfilm says on its website that it has 15 years of experience in the field of non-volatile memories using functional polymers. Its printed re-writable products are suitable for use in standalone consumer applications, including personalised toys and online-enabled games. They can also be integrated with logic elements, sensors, batteries, and displays for mass market applications such as all-printed RFID tags.
16.07.2012 Plasteurope.com [222843-0]
Published on 16.07.2012

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