BASF (Ludwigshafen / Germany; www.basf.com) is expanding its polyphthalamide (PPA) portfolio by its “Ultramid” Advanced N2U40G7 grade, which is particularly suited for connectors post-processed with surface mount technology (SMT).

Due to its low moisture uptake and high heat deflection temperature, the new PPA grade enhances the robustness, performance and reliability of power and data connectors in consumer electronics such as computers, laptops, servers, smart phones and smart household appliances and wearable devices. It can be used to manufacture extremely thin-wall connectors, has a V-0 rating at 0.2mm (UL94) and satisfies JEDEC Level 1 blistering test standards.

The material is available in tailor-made colours of high stability and supports with its flame-retardant expertise and material know-how for the SMT process.